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Examples

  • By utilizing the DCB leadframe concept, IXYS is able to provide the equivalent of any 'screw-type' power module in an SMPD version that can be easily mounted, in a low-cost reflow soldering process, onto any PCB-like standard discrete or IC devices.

    unknown title 2012

  • TM principle to create a power module replacement with a DCB leadframe and plastic molded structure.

    unknown title 2012

  • NANIUM is dedicated to providing development, manufacturing, testing and engineering services in the semiconductor business, operating namely in WLP/RDL and in traditional substrate and leadframe based packages.

    unknown title 2011

  • Designed to meet robust performance standards required in higher reliability industrial applications, the KPS family of devices utilizes leadframe technology to isolate the multilayer ceramic component from the printed circuit board.

    unknown title 2011

  • The IXYS ISOPLUS TM devices provided isolated package solutions for the power electronic industry for over 10 years with better thermal conductivity, lower weight and better power cycling when compared to copper based leadframe devices.

    unknown title 2012

  • Tyco Electronics engineers provided ruggedization improvements in the high-speed backplane connector designs by marrying an electrically sophisticated, high-speed contact leadframe with

    ThomasNet News - Today's New Product News 2010

  • "Unit shipments of 2.4 billion during the fourth quarter were up 4% from the third quarter, principally driven by the strength of leadframe wire bond packaging services," said Joanne Solomon, Amkor's chief financial officer.

    NewsBlaze.com Current News - Top Stories 2010

  • - Net revenues from advanced substrate and leadframe-based packaging accounted for 84% of total IC packaging net revenues during the quarter, down by 1 percentage point from the previous quarter.

    Advanced Semiconductor Engineering, Inc. Reports Unaudited Consolidated Financial Results for the Third Quarter of 2010 - Yahoo! Finance 2010

  • If a material such as a leadframe for a chip has a high cost, the procurement engineering team investigates why the cost is high.

    Purchasing - Top Stories 2010

  • Our connector and leadframe metal plating facilities offer

    The Gadgeteer 2010

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