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Examples

  • *** Technology Intel will use a new breed of three-dimensional transistors in its next generation of chips, packing more circuitry by building vertically from a wafer's surface.

    Business Watch 2011

  • Or what is the effective range of the wafer's anti-vampire action?

    Circling around the minefield, finding Dracula x00c5;ka 2008

  • Usually they won't pop open like pin tumbler locks, they just slide open; you don't get the warning that a pin tumbler gives before it opens because there is less contact area on the wafer's edge than on a pin, so the sense of climax is reduced with these types of locks.

    Secrets Of Lock Picking Hampton, Steven 1987

  • The proper quantity for a "tortilla" was taken up, first formed into a round ball, and then clapped out between the palms until it was only a wafer's thickness.

    The White Chief A Legend of Northern Mexico Mayne Reid 1850

  • Q3 is approximately because of flexible between the grid and the wafer's 100% utilized and cell also 100% utilized.

    unknown title 2011

  • We go through the same manufacturing process steps and in the large diffusion machine or poggle diffusion or large anti-reflective coating device, once the wafer's inside it doesn't matter really what its size is but getting it to it requires a different means of handling, different conveyance.

    SeekingAlpha.com: Home Page 2010

  • Even when the majority of the liquid is spin-dried, some remaining droplets can hold their position, especially at the wafer's center, where the centrifugal force is less than at the edge.

    Engineering Hardware-Software 2010

  • "With a single image we can define the wafer's location and orientation and run some simple inspections such as checking for edge/corner chips, cracks, breaks and physical dimensions before handling," he says.

    Engineering Hardware-Software 2010

  • RIE (Reactive Ion Etching): A form of dry etching in which ions are blasted at a wafer's surface.

    unknown title 2009

  • RIE (Reactive Ion Etching): A form of dry etching in which ions are blasted at a wafer's surface.

    unknown title 2009

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