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Examples
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CIAN participants at UC San Diego expect to upgrade the Chip-Scale Photonic Testing Facility from 40 Gbps to 100 Gbps (and greater) basic data rates.
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In the next few years, CIAN participants at UCSD expect to upgrade the basic data rates of the Chip-Scale Photonic Testing Facility from 40 Gbps to 100 Gbps (and greater).
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In the next few years, CIAN participants at UCSD expect to upgrade the basic data rates of the Chip-Scale Photonic Testing Facility from 40 Gbps to 100 Gbps (and greater).
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In the next few years, CIAN participants at UCSD expect to upgrade the basic data rates of the Chip-Scale Photonic Testing Facility from 40 Gbps to 100 Gbps (and greater).
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In the next few years, CIAN participants at UCSD expect to upgrade the basic data rates of the Chip-Scale Photonic Testing Facility from 40 Gbps to 100 Gbps (and greater).
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CIAN participants at UC San Diego expect to upgrade the Chip-Scale Photonic Testing Facility from 40 Gbps to 100 Gbps (and greater) basic data rates.
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Since the UNI/O devices only need a single I/O port to communicate with the microcontroller (MCU), selecting components in a Chip-Scale package is the next step to take when further reduction in the overall product size is needed.
ThomasNet News - Today's New Product News ThomasNet News 2010
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Measuring at 0.85 mm x 1.38 mm, the Wafer-Level Chip-Scale Package (WLCSP) is approximately the size of a die, and can support a manufacturing flow using standard pick-and-place machines.
ThomasNet News - Today's New Product News ThomasNet News 2010
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(FC), and Chip-Scale Packages (CSP), while packaging industry gained significance since 2000.
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In the next few years, CIAN participants at UCSD expect to upgrade the basic data rates of the Chip-Scale Photonic Testing Facility from 40 Gbps to 100 Gbps (and greater).
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